AI Solutions Innovation Roadshow

: Vertiv AI Solutions Innovation Roadshow; 2024/09/05 00:00; 2024/12/01 15:00
: setembro 05 - dezembro 01

Connect with our power and cooling experts at the Vertiv AI Innovation Roadshow. Get insights on the effects of accelerated IT and high-performance computing (HPC) on data centers, the challenges and opportunities, and what the journey to higher density could mean for your deployments.

Discover AI-ready solutions from Vertiv in several cities across North America. Our first stop will be at Westerville, OH, on Wednesday, April 10; explore the complete list of cities to find a stop near you.

Register today to learn how Vertiv’s comprehensive AI-ready portfolio powers and cools even the highest-density workloads in the most challenging deployments.

Coming to a city near you from July 2024

Connect with our AI Physical Infrastructure experts at the Vertiv AI Innovation Roadshow. Get insights on the effects of accelerated IT and high-performance computing (HPC) on data centers, the challenges and opportunities, and what the journey to higher density could mean for your deployments.

Discover AI-ready solutions from Vertiv in several cities across Europe and Middle East. Our first stop will be at London (UK) on July 11^th. Explore the complete list of cities to find a stop near you.

Register today to learn how Vertiv’s comprehensive AI-ready portfolio powers and cools even the highest-density workloads in the most challenging deployments.

Key AI infrastructure imperatives

Tailor power to AI workloads and explore power alternatives

Prepare for liquid cooling now and plan ahead for future architectures

Partnering with a seasoned industry leader like Vertiv instills the confidence needed to successfully deliver complex AI solutions.

Adapt your business approach and rethink services to keep sites running.

Integrate power and cooling systems for efficient management and innovation

Roadshow Route: Meet us at a city nearby

City	Date	Location
London	July 11th	No 6, 6 Alie Street, E1 8QT
Munich	September 5th	Vertiv Office, House of Communication, August-Everding-Str. 25, 81671
Riyadh	September 25th	Fairmont, Business Gate Qurtubah Area, 11552
Athens	October 3rd	The HUB Events, Java Hall, 5 Alkminis, str, 118 54
Madrid	October 8th	Hotel Imagine, C/ Agustín de Foxá, 32, 28036
Milan	October 10th	Hotel NH Collection Milano CityLife, Via Bartolomeo Co
Warsaw	October 15th	Centralny Dom Technologii, Krucza 50, 00-025
Paris	October 16th	Maison de la Recherche, 54 Rue de Varenne, 75007
Zagreb	October 24th	Buzinski Krci 3A, Buzin, 10010
Dubai	November 7th
Istanbul	November 14th

Invigorating discussions for AI deep-dive will equip you with information that will help you plan your high-density journey.

Power chain session topics

Power sourcing and distribution from grid to rack
Optimizing your energy storage deployment
Defining best-practices in energy storage technology and applications
Efficient and sustainable power architecture design

Thermal chain session topics

Traditional data centers cooling technologies
Transitioning traditional data centers to support AI
Building greenfield AI-ready datacenters

Only Vertiv can meet the power and cooling needs of your AI workloads

Vertiv has the technological expertise, portfolio breadth, services capabilities, operational footprint and industry partnerships to power and cool your HPC deployments. Join us to learn more about the solutions that will make your operations AI-ready.

Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

Technical partnerships with chipmakers leading the AI revolution.

End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

Services coverage with unmatched global reach and AI-ready capability.

Resilient manufacturing footprint able to scale up new technologies globally.

Unique pre-fabricated modular offering from single rack to entire data center.

Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

Technical partnerships with chipmakers leading the AI revolution.

End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

Services coverage with unmatched global reach and AI-ready capability.

Resilient manufacturing footprint able to scale up new technologies globally.

Unique pre-fabricated modular offering from a single rack to the entire data center.

Key drivers of growth

The development of the newest AI servers is driving heat loads to reach 6 kW to 10 kW per server. And chip, server, and rack heat densities are only continuing to rise.

Explore when to adopt Liquid Cooling for rising rack densities

Coming to a city near you from July 2024