Do I really need liquid cooling?
Why liquid cooling?
Liquid cooling can effectively manage up to and exceeding 120kw per rack
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Reduce total data center power consumption around 10.2%
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More than 15 percent improvement in total usage effectiveness (TUE)
Learn moreWhat to consider before deploying liquid cooling
Here is high-level guidance any team can use to navigate the incremental addition of liquid cooling to air-cooled environments cooling infrastructure.
Vertiv solutions and services
Vertiv™ Liebert® XDU
The Liebert® Coolant Distribution Unit is suitable for direct to chip and rear door cooling applications that offers easy, cost-effective deployment in any data center.
The XDU is available in Liquid-to-Liquid and Liquid-to-Air designs, operating with or without facility water, allowing the customer to tap into the benefits of liquid cooling without incurring the costs of major infrastructure changes
Vertiv™ Liebert® XDM Split Indoor Chiller
The Liebert® XDM Split Indoor Chiller is a liquid-to-fluid exchanger for rear door cooling applications that offers easy, cost-effective deployment in any data center.
The unit operates without facilities water and provides a chilled water secondary circuit, allowing you to tap into the benefits of water-cooled doors to more efficiently support higher rack densities without incurring the costs of significant infrastructure changes.
Vertiv™ Liebert® DCD
The Vertiv Liebert® DCD Rear Door Heat Exchanger is a highly efficient heat exchanger module that mounts on the rear of an IT rack, designed specifically for high heat density applications.
The hot air from the IT equipment passes through the rear door before entering back into the data center at room temperature, reducing the demand on room cooling infrastructure.
Liquid Cooling Services
IT and Facility teams can leverage partner project services to prepare for onsite liquid cooling installation, commissioning and start-up.
1. Navigating application design
2. Conducting offsite testing
3. Providing project management
4. Installing the new system
5. Starting up systems
6. Handing over the new system
Teams will also want to investigate ongoing services from equipment manufacturers to protect costly liquid cooling systems and ensure effective operations; such as conducting remote monitoring, managing fluids, performing preventive maintenance, and overseeing asset management.
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Choose your path to high-density
Your journey to high-density can be a smooth ride. No matter its starting point or final destination
Direct-to-Chip
Cold plates sit atop the heat-generating components (usually chips such as CPUs and GPUs) to draw off heat. Fluid flows through manifolds and in pipes through IT equipment, exchanging heat with cold plates to draw off heat without touching the chips. Air cooling is still required to extract heat from components that do not have a cold plate.
Rear door heat exchanger
Passive or active heat exchangers replace the rear door of the IT rack. Fluid goes through heat exchanging coils in the back of the rack absorbing heat in the air carried by the fans of IT equipment (hence why often called "air-to-liquid"). These are often used in combination with direct-to-chip as a strategy to keep room neutrality, or a transitional design enabling an easy conversion into direct-to-chip in the future.
Immersion Cooling
Servers and other IT equipment are submerged in a tank filled with thermally conductive but dielectric (electric non-conductive) fluid. There is no need of air cooling as equipment is the tank. This approach maximizes the thermal transfer properties of liquid and is often the most energy-efficient form of liquid cooling on the market.
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Vertiv is working together with leaders in the AI industry
Adding Vertiv expertise to the NVIDIA Partner Network
Vertiv and NVIDIA collaborated to develop a unique AI cooling solution for the COOLERCHIPS program and formalized our partnership when Vertiv joined the NVIDIA Partner Network. NVIDIA’s cutting-edge platforms need advanced infrastructure solutions. AI deployments can count on Vertiv’s leadership in power and cooling to keep their AI running no matter the cluster size.
Vertiv and NVIDIA AI Reference Design
The most complete power and cooling blueprint for next-generation AI factories with NVIDIA GB200 NVL72.
Supporting Intel’s latest generation AI accelerator
Vertiv is collaborating with Intel to provide liquid- and air-cooled solutions for the revolutionary Gaudi3 AI accelerator. Our liquid cooled solution has been tested at 160kW accelerator power using facility water from 17°C to 45°C (62.6°F to 113°F). The air-cooled solution has been tested up to 40kW of heat load that can be deployed in warm ambient air data centers up to 35°C (95°F).
Simulate the air-to-liquid cooling transition in Augmented Reality
Make the transition to hybrid and liquid-based cooling for your facility in augmented reality and experience the power of our high-density solutions first-hand, through Vertiv™ XR
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Explore High-Density Liquid Cooling Solutions in Virtual Reality
Orchestrate the thermal system upgrade needed, to support your high-density application, then deep-dive into the exploration of the liquid cooling solutions that make it possible in virtual reality, through theVertiv™ Virtual Showroom.
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