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Vertiv AI Solutions Innovation Roadshow
October 05 - March 01

Connect with our power and cooling experts at the Vertiv AI Innovation Roadshow. Get insights on the effects of accelerated IT and high-performance computing (HPC) on data centers, the challenges and opportunities, and what the journey to higher density could mean for your deployments.

Coming to a city near you from July 2024

Connect with our AI Physical Infrastructure experts at the Vertiv AI Innovation Roadshow. Get insights on the effects of accelerated IT and high-performance computing (HPC) on data centers, the challenges and opportunities, and what the journey to higher density could mean for your deployments.

Learn more about Services

Key AI infrastructure imperatives

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Tailor power to AI workloads and explore power alternatives

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Prepare for liquid cooling now and plan ahead for future architectures

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Partnering with a seasoned industry leader like Vertiv instills the confidence needed to successfully deliver complex AI solutions.

 

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Adapt your business approach and rethink services to keep sites running.

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Integrate power and cooling systems for efficient management and innovation

 
 

Roadshow Route: Meet us at a city nearby

Date Location
October 2024 Mexico
November 2024 Brazil
February 2025 Colombia
March 2025 Chile
March 2025 Peru
Q2 Central America

Invigorating discussions for AI deep-dive will equip you with information that will help you plan your high-density journey.

Power chain session topics

  • Power sourcing and distribution from grid to rack
  • Optimizing your energy storage deployment
  • Defining best-practices in energy storage technology and applications
  • Efficient and sustainable power architecture design

Thermal chain session topics

  • Traditional data centers cooling technologies
  • Transitioning traditional data centers to support AI
  • Building greenfield AI-ready datacenters

Only Vertiv can meet the power and cooling needs of your AI workloads

Vertiv has the technological expertise, portfolio breadth, services capabilities, operational footprint and industry partnerships to power and cool your HPC deployments. Join us to learn more about the solutions that will make your operations AI-ready.

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Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

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Technical partnerships with chipmakers leading the AI revolution.

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End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

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Services coverage with unmatched global reach and AI-ready capability.

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Resilient manufacturing footprint able to scale up new technologies globally.

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Unique pre-fabricated modular offering from single rack to entire data center.

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Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

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Technical partnerships with chipmakers leading the AI revolution.

icons-3.png

End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

icons-4.png

Services coverage with unmatched global reach and AI-ready capability.

icons-5.png

Resilient manufacturing footprint able to scale up new technologies globally.

icons-6.png

Unique pre-fabricated modular offering from a single rack to the entire data center.

Key drivers of growth 

The development of the newest AI servers is driving heat loads to reach 6 kW to 10 kW per server. And chip, server, and rack heat densities are only continuing to rise.

Explore when to adopt Liquid Cooling for rising rack densities

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